Power components and technology

The course is not on the list Without time-table
Code Completion Credits Range Language
BD5B13VST Z,ZK 4 14KP+6KL Czech
In order to register for the course BD5B13VST, the student must have registered for the required number of courses in the group BEZBM no later than in the same semester.
Garant předmětu:
Department of Electrotechnology

Production systems in electrical engineering will be characterized, their arrangement and basic technologies for mechanical joints and plastic parts. Manufacturing of windings,drying and impregnation processes will also been presented. Next part of a course will be focused on basic technologies for semiconductors including power integration. Beam technologies, technologies using plasma, packaging and basic assembly technologies will also been presented.


A student must attend at a practical training and must obtain an assessment before examination. A knowledge of lectured matter and laboratory tasks will be required at examination.

Syllabus of lectures:

1. Lasers and laser beams as a technological tool. Laser Beam Applications

2. Electron beam as a technological tool. Electron beam sources. Plasma technologies.

3. Thin layers. Use of thin films.

4. Thick layers. Dielectric heating.

5. Induction heating. Technological applications of power electric or current field.

6. Basics of winding technology.

7. Drying in electrical production.

8. Impregnation technology.

9. Technology of power wires and cables.

10. Power diodes, PIN diodes and Schottky diodes. Structure, basic characteristics.

11. Bipolar transistor. Structure, basic characteristics.

12. Current controlled components. Thyristors, switchable components.

13. Voltage-controlled components, MOSFET, IGBT transistor, structure, basic characteristics.

14. Passive components for use in power circuits.

Syllabus of tutorials:

1.Organization of labs, safety in the laboratory, explanation and demonstration of tasks 1 to 2

2.Explanation and demonstration of tasks 3 to 6

3.Vacuum drying and impregnation.

4.Soft soldering in electrical engineering.

5.Joining of power cables.

6. Joining of conductors and cables. Test.

7. Drilling and checking of PC boards.

8.Sputtering and evaporation of thin films.

9.Explanation and demonstration of tasks 7 to 9.

10.Task 7

11.Task 8

12.Task 9

13.Checking of laboratory results.


Study Objective:

Students learn basic types of technological processes used in electrical production as well as with basic types of power electronic components and their properties.

Study materials:

1.Benda, V. et al: Power Semiconductor Devices - Theory and Applications, J. Wiley, 1999

2. Bruce, R. G. et al.: Modern Materials and Manufacturing Processes, Prentice Hall, 2003

3. Pokharel, B. P., Karki, R. N.: Electrical Engineering Materials. Alpha Science, Oxford, 2007

4. Herman, S. L.: Electrical machines and transformers. Cengape Learning. 2012

5. Schaaf, P.: Laser processing of materials. Springer. 2012

6. Plasma processing, Hephaestus books, 2011

Chopra, K. L., Kaur, I.: Thin films devices applications. Plenum Press, 2011

Further information:
No time-table has been prepared for this course
The course is a part of the following study plans:
Data valid to 2024-07-24
Aktualizace výše uvedených informací naleznete na adrese https://bilakniha.cvut.cz/en/predmet4979606.html