Construction and Technology

The course is a substitute for:

Construction and Technology (X13KAT)

Lecturer:

Tutor:

Supervisor:

Department of Electrotechnology

Synopsis:

Basic technological processes for manufacturing of electronic equipment and components. Processes for manufacturing of thin and thick films and components, technology of manufacturing of rigid and ductile printed circuit boards and their testing. Manufacturing of PN junctions, displays and recordable mediums. Beam and plasma technologies. Packaging of contemporary electronic components. Joining of components and printed circuit boards. Packaging multichip modules, 3D assembly. Temperature of components and equipment. Screening and grounding of components and equipment.

Requirements:

A student has to obtain a credit before an examination

Syllabus of lectures:

1.Classification of technological processes in electronic production and their control

2.Manufacturing of thin films and thin film components

3.Manufacturing of thick films and thick film components

4.Technology of printed circuit boards, rigid boards, ductile boards, testing

5.Manufacturing of PN junctions and basic semiconductor components. Influence of technology on properties

6.Manufacturing of vacuum displays and LCD displays

7.Recordable mediums - basic principles. Medium based on magnetic a magnetooptic principles

8.Processes for manufacturing and components of ,one electron electronics". Electron beam and plasma technology

9.Laser technologies for fabrication of electronic components

10.Packaging of electronic components and equipment

11.Joining of chips, components and PCBs

12.Multichip modules, 3D assembly

13.Temperature of components in packages, temperature of equipment

14.Screening and grounding of components and equipment

Syllabus of tutorials:

1.Organization of labs, safety in the laboratory, explanation and demonstration of tasks 1 - 3

2.Explanation and demonstration of tasks 4 - 6

3.Soft soldering in electronics and properties of soldered joints

4.Conductive joining in electronics and properties of adhesive joints

5.Joining of conductors and cables in electronic equipment

6.Test. Checking of laboratory results. Video

7.Drilling and checking of PC boards

8.Assembly of optical connectors

9.THT and SMT. Assembly and disassembly

10.Explanation and demonstration of tasks 7 - 9

11.Evaporating of thin films

12.Sputtering of thin films

13.Manufacturing of thick film resistive components

14.A credit

Study Objective:

Study materials:

1.Tummala, R. R. et al. Microelectronics Packaging Handbook. N.Y.: Chapman&Hall. 1997

Note:

Further information:

No time-table has been prepared for this course

The course is a part of the following study plans:

• Electronics and Communication Technology - structured studies (compulsory elective course)