Construction and Technology
| Code | Completion | Credits | Range | Language |
|---|---|---|---|---|
| X13KAT | KZ | 4 | 2+2L | Czech |
- Lecturer:
- Jan Urbánek, Pavel Mach (gar.)
- Tutor:
- Jan Urbánek, Pavel Mach (gar.), Ivana Beshajová Pelikánová, Jakub Cinert, Jan Jirsa, Stanislav Seborský, Marek Tučan
- Supervisor:
- Department of Electrotechnology
- Synopsis:
-
Basic technological processes for manufacturing of electronic equipment and components. Processes for manufacturing of thin and thick films and components, technology of manufacturing of rigid and ductile printed circuit boards and their testing. Manufacturing of PN junctions, displays and recordable mediums. Beam and plasma technologies. Packaging of contemporary electronic components. Joining of components and printed circuit boards. Packaging multichip modules, 3D assembly. Temperature of components and equipment. Screening and grounding of components and equipment.
- Requirements:
-
Active attendance and accomplishment of tasks at tutorials are necessary conditions for award an assessment. A student must get an assessment before an examination. A knowledge of a lectured and tutorial matters will be required at examination.
- Syllabus of lectures:
-
1.Classification of technological processes in electronic production and their control
2.Manufacturing of thin films and thin film components
3.Manufacturing of thick films and thick film components
4.Technology of printed circuit boards, rigid boards, ductile boards, testing
5.Manufacturing of PN junctions and basic semiconductor components. Influence of technology on properties
6.Manufacturing of vacuum displays and LCD displays
7.Recordable mediums - basic principles. Medium based on magnetic a magnetooptic principles
8.Processes for manufacturing and components of ,one electron electronics". Electron beam and plasma technology
9.Laser technologies for fabrication of electronic components
10.Packaging of electronic components and equipment
11.Joining of chips, components and PCBs
12.Multichip modules, 3D assembly
13.Temperature of components in packages, temperature of equipment
14.Screening and grounding of components and equipment
- Syllabus of tutorials:
-
1.Organization of labs, safety in the laboratory, explanation and demonstration of tasks 1 - 3
2.Explanation and demonstration of tasks 4 - 6
3.Soft soldering in electronics and properties of soldered joints
4.Conductive joining in electronics and properties of adhesive joints
5.Joining of conductors and cables in electronic equipment
6.Test. Checking of laboratory results. Video
7.Drilling and checking of PC boards
8.Assembly of optical connectors
9.THT and SMT. Assembly and disassembly
10.Explanation and demonstration of tasks 7 - 9
11.Evaporating of thin films
12.Sputtering of thin films
13.Manufacturing of thick film resistive components
14.A credit
- Study Objective:
-
Overview of Process for the manufacture of electronic components and electronic equipment. Principles of design of reliable systems - cooling, electrical connections, shielding.
- Study materials:
-
Tummala, R. R. et al. Microelectronics Packaging Handbook. N.Y.:
Chapman&Hall. 1997
- Note:
- Time-table for winter semester 2011/2012:
-
06:00–08:0008:00–10:0010:00–12:0012:00–14:0014:00–16:0016:00–18:0018:00–20:0020:00–22:0022:00–24:00
Mon Tue Fri Thu Fri - Time-table for summer semester 2011/2012:
-
06:00–08:0008:00–10:0010:00–12:0012:00–14:0014:00–16:0016:00–18:0018:00–20:0020:00–22:0022:00–24:00
Mon Tue Fri Thu Fri - The course is a part of the following study plans:
-
- Electronics and Communication Technology - structured studies (compulsory elective course)
- Softwarové inženýrství (elective specialized course)
- Web a multimedia (elective specialized course)
- Manažerská informatika (elective specialized course)
- Inteligentní systémy (elective specialized course)