Construction of Telecommunications Equipment

The course is a substitute for:

Construction of Telecommunications Systems (X32KTZ)

Lecturer:

Tutor:

Supervisor:

Department of Telecommunications Engineering

Synopsis:

The course starts with logical principles of construction applied to modular telecommunication facility. It covers influences substantial for ensuring of design, manufacture and operation of the facility. Topics of dimensioning, tolerance respecting, cooling etc. are discussed with respect to utilisation of modern technologies of printed circuits mounting. Reliability issues of designed facility are emphasised.

Requirements:

Syllabus of lectures:

1. Elements and construction structures of telecommunication systems

2. Basic switching elements, their principles. Comparison of properties

3. Power loss of semiconductor elements, construction of coolers

4. Tolerance analysis of the circuits. The Monte Carlo stochastic method

5. Technology of manufacturing single- and multilayer printed circuit boards

6. Typical technologies of filling the boards. Surface mounting

7. Connecting of conductors - wrapping, soldering, cutting

8. Weather and mechanical resistance of products. Methods of increasing them

9. Quality control systems. Control of the production quality

10. Basic terms, criteria and indices of reliability

11. Sources of data on reliability of components. Influence of operational conditions

12. Approximation of failures origin and removal processes

13. Reliability of systems. Serial, parallel and compound failure models

14. Solving of the systems with restoration using the methods of bulk service theory

Syllabus of tutorials:

1. Introduction. Safety instructions for laboratory work. Conditions for assessment obtaining

2. Construction structures of telecommunication facilities. Schemes and symbols

3. Measurement on contacts

4. Circuitry design and construction of semiconductor switching circuit

5. Tolerance analysis using Monte Carlo method

6. Methods of designing wire and printed circuits. Technologies of conductor mounting

7. Excursion. Computer workplace for designing printed circuits

8. Quality testing. Standardisation and the ISO standards. The spiral of quality. Certification

9. Weather and mechanical resistance of products. Typical operational environments

10. Methods of collecting data on quality. Catalogue and computer processing of data files

11. Computer-aided solutions of reliably using serial failure model

12. Parallel failure models. Efficiency of various redundancy types

13. Computer-aided dimensioning of the system for repairing of damaged units

14. Compensatory lesson. Assessments

Study Objective:

Study materials:

Recommended literature will be specified by lecturer.

Note:

Further information:

No time-table has been prepared for this course

The course is a part of the following study plans: