Technology in Electrical Engineering

Lecturer:

Pavel Mach (gar.), Vítězslav Benda (gar.), Jan Kuba

Tutor:

Pavel Mach (gar.), Vítězslav Benda (gar.), Ladislava Černá, Karel Dušek, Pavel Hrzina, Jan Kuba

Supervisor:

Department of Electrotechnology

Synopsis:

Production systems in electrical engineering will be characterized, their arrangement and basic technologies for mechanical joints and plastic parts. Manufacturing of windings,drying and impregnation processes will also been presented. Next part of a course will be focused on basic technologies for semiconductors including power integration. Beam technologies, technologies using plasma, packaging and basic assembly technologies will also been presented.

Requirements:

A student must attend at a practical training and must obtain an assessment before examination. A knowledge of lectured matter and laboratory tasks will be required at examination.

Syllabus of lectures:

1.Basic semiconductor structures. Characteristics, technological possibilities, realizations.

2.Power PIN and Schottky diodes. Static and dynamic parameters. Static and dynamic characteristics. Applications.

3. Current controlled devices. Thyristors (SCR), GTO, GTC, IGCT. Applications.

4.Voltage controlled devices (VDMOS, TMOS). IGBT, Structure and parameters. Applications.

5. Power integration. Power modules, principles, construction, technology. IPM. Cooling. Applications.

6.Beam technology in electrical engineering. Plasma technology in electrical engineering. Technology based on power electrical field.

7.Packaging of components for power electrical engineering.

8.Film technology and film components for power electrical engineering. Rapid prototyping.

9. HF and dielectric heating. Applications.

10.Winding of electrical machines - types, technology, drying, applications

11.Magnetic circuits of electrical machines - types, technology

12.Technology of surface finishes and protective layers.

13.Production systems in electrical engineering, types, arrangement.

Syllabus of tutorials:

1.Organization of labs, safety in the laboratory, explanation and demonstration of tasks 1 to 2

2.Explanation and demonstration of tasks 3 to 6

3.Vacuum drying and impregnation.

4.Soft soldering in electrical engineering.

5.Joining of power cables.

6. Joining of conductors and cables. Test.

7. Drilling and checking of PC boards.

8.Sputtering and evaporation of thin films.

9.Explanation and demonstration of tasks 7 to 9.

10.Task 7

11.Task 8

12.Task 9

13.Checking of laboratory results.

14.Assessment.

Study Objective:

Students learn basic types of technological processes used in electrical production as well as with basic types of power electronic components and their properties.

Study materials:

1.Benda, V. et al: Power Semiconductor Devices - Theory and Applications, J. Wiley, 1999

2. Bruce, R. G. et al.: Modern Materials and Manufacturing Processes, Prentice Hall, 2003

3. Brown, W. D.: Advanced Electronic Packaging, IEEE Press, 1998

Note:

Time-table for winter semester 2011/2012:

Time-table is not available yet

Time-table for summer semester 2011/2012:

	06:00–08:0008:00–10:0010:00–12:0012:00–14:0014:00–16:0016:00–18:0018:00–20:0020:00–22:0022:00–24:00
Mon	roomT2:C4-264 Mach P. Benda V. 11:00–12:30 (lecture parallel1) Dejvice Laborator 264roomT2:G1-122b Dušek K. 12:45–14:15 (lecture parallel1 parallel nr.1) Dejvice haly Laborator 122 roomT2:E1-3c Černá L. 12:45–14:15 (lecture parallel1 parallel nr.1) Dejvice haly Laborator L3
Tue
Fri
Thu
Fri

The course is a part of the following study plans:

• Electrical Engineering, Power Engineering and Management - Applied Electrical Engineering (compulsory course in the program)
• Electrical Engineering, Power Engineering and Management - Electrical Engineering and Management (compulsory course in the program)
• Electrical Engineering, Power Engineering and Management (compulsory course in the program)