Electrotechnical Materials and Technology

The course is a substitute for:

Electrotechnical Materials and Technology (X13EMT)

Lecturer:

Tutor:

Supervisor:

Department of Electrotechnology

Synopsis:

Structure, properties, preparation and using of conductive, dielectric, magnetic, superconductors, constructive, semiconductors and special materials. Technological processes of electronic production. Joining of components using soldering and adhesive joining. Printed circuit boards. Assembly of electronic equipment. Packaging, microvia technology and contemporary methods of packaging. Manufacturing and working environment. Protection of components and equipment sensitive to electrostatic discharge. In-process control, testing, rework, repair.

Requirements:

A student has to obtain a credit before an examination

Syllabus of lectures:

1.Structure, properties, preparation and using of conductive and superconductive materials

2.Structure, properties, preparation and using of dielectric and insulating materials

3.Structure, properties, preparation and using of constructive and magnetic materials

4.Structure, properties, preparation and using of semiconductors and optic materials

5.Basic processes in manufacturing of semiconductive components

6.Film technologies in manufacturing of passive components

7.Composite materials. Printed circuit boards

8.Soldered joints. Joint realized using electrically conductive adhesives

9.Assembly technologies - THT, SMT

10.Packaging and joining of electronic components, hierarchy of packages

11.Multichip modules, packages of the type 3D

12.Manufacturing and working environment

13.Protection of components and equipment sensitive to electrostatic discharge

14.In-process control, testing, rework, repair

Syllabus of tutorials:

Training will be organized like measurement and individual work in laboratories

1.Organization of laboratory training, safeness of the work in laboratories

2.Resistivity of insulators

3.Anisotropy of Si sheets

4.Evaporation and sputtering of thin films

5.Conductive joints and conductive joining, demonstration, individual work

6.Measurement of properties of joints prepared during last training

7.Solderability of leads of components

8.Protection of components sensitive to electrostatic field

9.Drilling and checking of printed circuit boards

10.Assembly and repair of printed circuit boards I

11.Assembly and repair of printed circuit boards II

12.Video programs of manufacturing equipment

13.Diagnostics in electronics production - video programs

14.A credit

Study Objective:

Study materials:

1.Livingston, J. D. Electronic properties of engineering materials. New York : Wiley & Sons, Ltd. 1999

Note:

Further information:

No time-table has been prepared for this course

The course is a part of the following study plans: