Essential Manufacturing Processes

The course is a substitute for:

Manufacturing Processes (E13TEP)
Materials and Technology for Power Electrical Engineering (X13TEP)

Lecturer:

Tutor:

Supervisor:

Department of Electrotechnology

Synopsis:

Production systems in electrical engineering and their characteristics. Technology of electrical and mechanical joints of elements and parts. Surface protection and modification of elements and components. Metalic conductor and cable technology. Manufacturing of windings. Drying and impregnation processes. PCB technology, assembly of electrical components, surface mount technology, mass soldering. Thick and thin film technology, beam and plasmas technologies and their utilizations. Packaging of power electronic components.

Requirements:

A student has to obtain a credit before an examination

Syllabus of lectures:

1.Production systems in electrical engineering and their characteristics.

2.Technology of electrical and mechanical joints

3.Surface protection and modification of components

4.Metalic conductor and cable technology

5.Technology of windings

6.Drying in electrical fabrication

7.Impregnation processes

8.Manufacturing of boards

9.THT and SMT assembly, mass soldering of assembled boards

10.Thin films technology

11.Thick films technology

12.Beam and plasma technologies

13.Technology for manufacturing of PN junctions

14.Packaging of power electronic components

Syllabus of tutorials:

1.Organization of labs, safety in the laboratory, explanation and demonstration of tasks 1 - 3

2.Explanation and demonstration of tasks 4 - 6

3.Vacuum drying and impregnation

4.Soft soldering in electrical engineering

5.Joining of power cables

6.Test. Checking of laboratory results. Video

7.Drilling and checking of PC boards

8.Joining of conductors and cables

9.Assembly of optical connectors

10.Explanation and demonstration of tasks 7 - 9

11.Computer controlled turning I.

12.Computer controlled turning II.

13.Sputerring and evaporation of thin films

14.A credit

Study Objective:

Study materials:

1. Deborah,D.L., Chung,I. Materials for electronic packaging. USA

Note:

Further information:

No time-table has been prepared for this course

The course is a part of the following study plans:

• Heavy-current Engineering- structured studies (compulsory course)