Technological Processes in Electronic Manufacturing

Lecturer:

Pavel Mach (gar.)

Tutor:

Pavel Mach (gar.)

Supervisor:

Department of Electrotechnology

Synopsis:

Development of technology of packaging. Contemporary methods of packaging of components SOP, DIP, SIP, ZIP, QFP and others, properties, advantages. Comparison of packages from the viewpoint of environmental resistivity. Classification of multichip modules. Multichip modules of different types: MCM-L, MCM-C, MCM-D, PMCM. Substrates for multichip modules. Technology of contacting og dies. Electrical design of MCMs. Thermal design of MCMs. Physical design of MCMs. Parameters for evaluation of MCMs. Reliability of MCMs. Design tools. Programmable modules. Applications of MCMs.

Requirements:

Syllabus of lectures:

Syllabus of tutorials:

Study Objective:

Study materials:

Tummala, R. R.: Introduction to Microelectronics Packaging, McGraw-Hill, 2001

Harper, C. A.: Electronic Packaging and Interconnection Handbook, McGraw-Hill, 2004

Note:

Time-table for winter semester 2011/2012:

Time-table is not available yet

Time-table for summer semester 2011/2012:

Time-table is not available yet

The course is a part of the following study plans:

• Doctoral studies, daily studies (compulsory elective course)
• Doctoral studies, combined studies (compulsory elective course)
• Doctoral studies, structured daily studies (compulsory elective course)
• Doctoral studies, structured combined studies (compulsory elective course)