Construction and Technology

Lecturer:

Jan Urbánek (gar.), Pavel Mach (gar.)

Tutor:

Jan Urbánek (gar.), Pavel Mach (gar.)

Supervisor:

Department of Electrotechnology

Synopsis:

Basic technological processes for manufacturing of electronic equipment and components. Processes for manufacturing of thin and thick films and components, technology of manufacturing of rigid and ductile printed circuit boards and their testing. Manufacturing of PN junctions, displays and recordable mediums. Beam and plasma technologies. Packaging of contemporary electronic components. Joining of components and printed circuit boards. Packaging multichip modules, 3D assembly. Temperature of components and equipment. Screening and grounding of components and equipment.

Requirements:

A student has to obtain a credit before an examination

Syllabus of lectures:

1.Classification of technological processes in electronic production and their control

2.Manufacturing of thin films and thin film components

3.Manufacturing of thick films and thick film components

4.Technology of printed circuit boards, rigid boards, ductile boards, testing

5.Manufacturing of PN junctions and basic semiconductor components. Influence of technology on properties

6.Manufacturing of vacuum displays and LCD displays

7.Recordable mediums - basic principles. Medium based on magnetic a magnetooptic principles

8.Processes for manufacturing and components of „one electron electronics“. Electron beam and plasma technology

9.Laser technologies for fabrication of electronic components

10.Packaging of electronic components and equipment

11.Joining of chips, components and PCBs

12.Multichip modules, 3D assembly

13.Temperature of components in packages, temperature of equipment

14.Screening and grounding of components and equipment

Syllabus of tutorials:

1.Classification of technological processes in electronic production and their control

2.Manufacturing of thin films and thin film components

3.Manufacturing of thick films and thick film components

4.Technology of printed circuit boards, rigid boards, ductile boards, testing

5.Manufacturing of PN junctions and basic semiconductor components. Influence of technology on properties

6.Manufacturing of vacuum displays and LCD displays

7.Recordable mediums - basic principles. Medium based on magnetic a magnetooptic principles

8.Processes for manufacturing and components of „one electron electronics“. Electron beam and plasma technology

9.Laser technologies for fabrication of electronic components

10.Packaging of electronic components and equipment

11.Joining of chips, components and PCBs

12.Multichip modules, 3D assembly

13.Temperature of components in packages, temperature of equipment

14.Screening and grounding of components and equipment

Study Objective:

Overview of Process for the manufacture of electronic components and electronic equipment. Principles of design of reliable systems - cooling, electrical connections, shielding.

Study materials:

1. Tummala, R. R. et al. Microelectronics Packaging Handbook. N.Y.: Chapman&Hall. 1997

Note:

Time-table for winter semester 2011/2012:

	06:00–08:0008:00–10:0010:00–12:0012:00–14:0014:00–16:0016:00–18:0018:00–20:0020:00–22:0022:00–24:00
Mon	roomT2:C4-264 Mach P. Urbánek J. 14:30–16:00 (lecture parallel1) Dejvice Laborator 264
Tue
Fri
Thu
Fri

Time-table for summer semester 2011/2012:

Time-table is not available yet

The course is a part of the following study plans:

• Electronics and Communication Technology - structured studies (compulsory elective course)
• Inteligentní systémy (elective specialized course)
• Manažerská informatika (elective specialized course)
• Softwarové inženýrství (elective specialized course)
• Web a multimedia (elective specialized course)