Electronic Devices Packaging

Lecturer:

Tutor:

Supervisor:

Department of Electrotechnology

Synopsis:

Causes and meaning of electronic components interconnecting. Cases and packaging - design and properties of cases. Materials and technology of packaging. Electrical and thermal design of cases. Technological design of interconections. Discrete electronic elements packaging. Joining of chips. Basic types of multichip modules. Substrates, technology and properties of MCM-L, MCM-C, MCM-D. New cases with high efficiency of packaging. Cases type 3D - materials and technology.

Requirements:

A student has to obtain a credit before an examination

Syllabus of lectures:

1.Packaging and interconnection of electronic circuits and systems

2.Hierarchy of packages and interconnections

3.Level of packaging. Basic function of case.

4.Materials and technology of packaging

5.Electrical design of cases

6.Thermal design of cases

7.Technological design of interconnections

8. Chip packaging

9. Discrete electronic elements packaging

10.Multichip modules packaging

11.Technology and properties of MCM-Ls

12.Technology and properties of MCM-Cs

13.Technology and properties of MCM-Ds

14.Cases type 3D

Syllabus of tutorials:

1.Organization of labs, safety of the work, distribution of individual tasks

2.Noise and nonlinearity of metal and polymer interconnections

3.Manufacturing of polymer thick films

4.Measurement on polymer conductive structures

5.Measurement on metal conductive structures

6.Aging by thermal cycles

7.Demonstrations of cases samples

8.Measurement of parameters of samples after aging - Part 1

9.Measurement of parameters of samples after aging - Part 2

10.Measurements of thermal parameters of samples

11.Microscopic investigation of structural parameters

12.Individual tasks -- evaluation - part 1

13.Individual tasks - evaluation - part 2

14.Evaluation of experiments. A credit

Study Objective:

Study materials:

1. Sherwani, N. A., Yu, Q., Badida, S.: Introduction to multichip modules.

New York : John Wiley & Sons. 1995

2. Tummala, R. , Rymaszewski, E. Microelectronics packaging handbook. New

York : Van Nostrand Reinhold. 1989

Note:

Further information:

No time-table has been prepared for this course

The course is a part of the following study plans:

• Electronics - Electronic Systems- structured studies (compulsory elective course)
• Electronics - Electronic Applications- structured studies (compulsory elective course)
• Electronics - Electronics and Photonics- structured studies (compulsory elective course)