Technology of Multichip Modules

Lecturer:

Tutor:

Supervisor:

Department of Electrotechnology

Synopsis:

Causes of development of multichip modules. Basic types of multichip modules. Electrical and thermal proposal of MCMs. Joining of chips - wire bonding, flip-chip, chip-on board, TAB. Substrates, technology and properties of MCM- L. Substrates, technology and properties of MCM-C. Substrates, technology and properties of MCM-D. Substrates, technology and properties of MCM-P. Packaging.

Requirements:

Syllabus of lectures:

1. Packaging and interconnection of electronic circuits and systems

2. Hierarchy of packages and interconnections

3. Multichip modules (MCM) - types, characteristics

4. Electrical and thermal design of MCMs

5. Generation and transport of heat, ways of cooling

6. Technological design of interconnections

7. Joining of chips - wire bonding, flip-chip

8. Joining of chips - chip-on board, TAB

9. Materials of substrates. Thick and thin structures of modules

10. Technology and properties of MCM-Ls

11. Technology and properties of MCM-Cs

12. Technology and properties of MCM-Ds

13. Technology and properties of MCM-Ps

14. Packaging of MCMs

Syllabus of tutorials:

1. Organization of labs, safety of the work, distribution of individual tasks

2. Noise and nonlinearity of metal and polymer interconnections

3. Manufacturing of polymer thick films

4. Joining of leds by soldering

5. Measurement on polymer conductive structures

6. Measurement on metal conductive structures

7. Aging by thermal cycles

8. Measurement of parameters of samples after aging - Part 1

9. Measurement of parameters of samples after aging - Part 2

10. Measurement of thermal parameters of samples

11. Preparation of samples for investigation of a structure

12. Microscopic investigation of structural parameters

13. Evaluation of experiments

14. Evaluation of individual tasks, a credit

Study Objective:

Study materials:

[1] Sherwani, N. A.,Yu, Q., Badida, S.: Intr. to multichip mod., J. Wiley Inc., N.Y. 1995

[2] Tummala, R. R., Rymaszewski, E.: Microelectronics packaging handbook. Van Nostrand Reinhold, N. York 1989

Note:

Further information:

No time-table has been prepared for this course

The course is a part of the following study plans:

• Technologické systémy -inženýrský blok (compulsory elective course)
• Technologické systémy -inženýrský blok (compulsory elective course)