Manufacturing of Electronics Equipment
Code | Completion | Credits | Range |
---|---|---|---|
13VEZ | Z,ZK | 6 | 3+2s |
- The course is a substitute for:
- Manufacturing of Electronic Equipment (X13VEZ)
- Lecturer:
- Tutor:
- Supervisor:
- Department of Electrotechnology
- Synopsis:
-
Mechanical and electrical design. The electric contact. Thermal regime of boards and equipment. Cooling of components and equipment. Electromagnetic compatibility. Computer aided design of printed circuit boards. Printed circuit boards fabrication. Soldering. Methods of board repairs. Computer-integrated systems of production. Certification, accreditation. European conformity CE.
- Requirements:
- Syllabus of lectures:
-
1. Mechanical and electrical design of electronics equipment
2. Mechanical and metallurgical joints in electronics
3. Electrical contacts. Connectors
4. Soldering in electronics
5. PCBs of different types including flexible PCBs
6. Assembly in electronics - THT and SMT
7. Control, testing and repair of PCBs
8. Temperature conditions of components, PCBs and equipment
9. Electromagnetic compatibilty
10. Shielding of workplaces and equipment
11. Working and fabrication environment
12. Protection of components and equipment sensitive on electrostatic field
13. In-production control, control of electronic production
14. ISO 9000, ISO 14 000, control and assurance of quality
- Syllabus of tutorials:
-
1. Safety of operation in laboratories. Instructions of tasks
2. Joints, jointing in electronics
3. Electromechanical contact systems
4. Testing of solderability
5. Testing of ionic contamination of devices and PCBs
6. Measurement of contact resistance
7. Electrostatic discharge sensitive components. Test
8. Demonstrate of EPA (ESD protected area) - SIEMENS
9. Demonstrate of fabrication PCBs with SMT - TTC
10. Testing of PCBs
11. Inspection, reworks and repairs of PCBs 1
12. Inspection, reworks and repairs of PCBs 2
13. Shielding
14. Estimate reports of tests. A credit
- Study Objective:
- Study materials:
-
[1] Hwang, J. S. Modern Solder Technology for Competetive Electronics Manufacturing. McGraw-Hill, New York 1996.
[2] Sung Jim Kim, Sang Woo Lee. Air Cooling Technology for Electronic Equipment. CRC Press, Inc. New York. 1996
- Note:
- Further information:
- No time-table has been prepared for this course
- The course is a part of the following study plans:
-
- Technologické systémy -inženýrský blok (compulsory course)
- Technologické systémy -inženýrský blok (compulsory course)