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CZECH TECHNICAL UNIVERSITY IN PRAGUE
STUDY PLANS
2011/2012

Manufacturing of Electronics Equipment

The course is not on the list Without time-table
Code Completion Credits Range
13VEZ Z,ZK 6 3+2s
The course is a substitute for:
Manufacturing of Electronic Equipment (X13VEZ)
Lecturer:
Tutor:
Supervisor:
Department of Electrotechnology
Synopsis:

Mechanical and electrical design. The electric contact. Thermal regime of boards and equipment. Cooling of components and equipment. Electromagnetic compatibility. Computer aided design of printed circuit boards. Printed circuit boards fabrication. Soldering. Methods of board repairs. Computer-integrated systems of production. Certification, accreditation. European conformity CE.

Requirements:
Syllabus of lectures:

1. Mechanical and electrical design of electronics equipment

2. Mechanical and metallurgical joints in electronics

3. Electrical contacts. Connectors

4. Soldering in electronics

5. PCBs of different types including flexible PCBs

6. Assembly in electronics - THT and SMT

7. Control, testing and repair of PCBs

8. Temperature conditions of components, PCBs and equipment

9. Electromagnetic compatibilty

10. Shielding of workplaces and equipment

11. Working and fabrication environment

12. Protection of components and equipment sensitive on electrostatic field

13. In-production control, control of electronic production

14. ISO 9000, ISO 14 000, control and assurance of quality

Syllabus of tutorials:

1. Safety of operation in laboratories. Instructions of tasks

2. Joints, jointing in electronics

3. Electromechanical contact systems

4. Testing of solderability

5. Testing of ionic contamination of devices and PCBs

6. Measurement of contact resistance

7. Electrostatic discharge sensitive components. Test

8. Demonstrate of EPA (ESD protected area) - SIEMENS

9. Demonstrate of fabrication PCBs with SMT - TTC

10. Testing of PCBs

11. Inspection, reworks and repairs of PCBs 1

12. Inspection, reworks and repairs of PCBs 2

13. Shielding

14. Estimate reports of tests. A credit

Study Objective:
Study materials:

[1] Hwang, J. S. Modern Solder Technology for Competetive Electronics Manufacturing. McGraw-Hill, New York 1996.

[2] Sung Jim Kim, Sang Woo Lee. Air Cooling Technology for Electronic Equipment. CRC Press, Inc. New York. 1996

Note:
Further information:
No time-table has been prepared for this course
The course is a part of the following study plans:
Generated on 2012-7-9
For updated information see http://bilakniha.cvut.cz/en/predmet10980904.html