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CZECH TECHNICAL UNIVERSITY IN PRAGUE
STUDY PLANS
2019/2020

Electrical engineering technological processes

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Code Completion Credits Range Language
B1B13TEP Z,ZK 4 3P+2L Czech
Corequisite:
Lecturer:
Karel Dušek, Pavel Mach (guarantor), Jan Kuba
Tutor:
Karel Dušek, Pavel Mach (guarantor), Ivana Beshajová Pelikánová, Denis Froš, Eva Horynová, Vilém Koblížek, Jan Kuba, Tomáš Tichý, Petr Veselý
Supervisor:
Department of Electrotechnology
Synopsis:

Technologies used in electronics, laser, and other beam technologies and IC packaging will be characterized. There will also be discussed fundamentals of winding, drying and impregnation processes. The subject is also the basis for producing single-crystal Si. Technology using plasma technology, packaging, and basic assembly technologies are also presented.

Requirements:

A student must attend at a practical training and must obtain an assessment before examination. A knowledge of lectured matter and laboratory tasks will be required at examination.

Syllabus of lectures:

1. Lasers and laser beam as a technological tool. Application of a laser beam.

2. Electron, ion and molecular beam. Sources, technology, applications.

3. Plasma and technologies using plasma. Applications. Manufacturing Si single crystals.

4. Packaging of electronic devices. Technology of electronic assembly.

5. Resistive, inductive and dielectric heating and applications. Principle of a magnetron.

6. Processes in power electrical and current fields.

7. Principles, materials, technology and application of 3D printing.

8. Fundamentals of technology and production winding.

9. Drying and impregnation technology in electrical engineering.

10. Conductors and superconductors for electrical devices.

11. Metalic cables for power and communication applications.

12. Technology of surface finishes and protective layers.

13. Technology of power conductors and cables.

14. Production systems in electrical engineering, types, arrangement.

Syllabus of tutorials:

1.Organization of labs, safety in the laboratory, explanation and demonstration of tasks 1 to 2

2.Explanation and demonstration of tasks 3 to 6

3.Vacuum drying and impregnation.

4.Soft soldering in electrical engineering.

5.Joining of power cables.

6. Joining of conductors and cables. Test.

7. Drilling and checking of PC boards.

8.Sputtering and evaporation of thin films.

9.Explanation and demonstration of tasks 7 to 9.

10.Task 7

11.Task 8

12.Task 9

13.Checking of laboratory results.

14.Assessment.

Study Objective:

Students learn basic types of technological processes used in electrical production as well as with basic types of power electronic components and their properties.

Study materials:

1. Schaaf, P.: Laser processing of materials. Springer. 2012

2. Plasma processing, Hephaestus books, 2011

3. Bruce, R. G. et al.: Modern Materials and Manufacturing Processes, Prentice Hall, 2003

4. Pokharel, B. P., Karki, R. N.: Electrical Engineering Materials. Alpha Science, Oxford, 2007

5. Herman, S. L.: Electrical machines and transformers. Cengape Learning. 2012

Note:
Time-table for winter semester 2019/2020:
Time-table is not available yet
Time-table for summer semester 2019/2020:
06:00–08:0008:00–10:0010:00–12:0012:00–14:0014:00–16:0016:00–18:0018:00–20:0020:00–22:0022:00–24:00
Mon
Tue
Fri
roomT2:D3-309

11:00–13:30
(lecture parallel1)
Dejvice
T2:D3-309
Thu
roomT2:G1-127

09:15–10:45
(lecture parallel1)
Dejvice haly
Laborator 127
roomT2:G1-127

11:00–12:30
(lecture parallel1)
Dejvice haly
Laborator 127
roomT2:G1-127

14:30–16:00
(lecture parallel1)
Dejvice haly
Laborator 127
roomT2:G1-127

16:15–17:45
(lecture parallel1)
Dejvice haly
Laborator 127
roomT2:G1-122b

09:15–10:45
(lecture parallel1)
Dejvice haly
Laborator 122
roomT2:G1-122b

11:00–12:30
(lecture parallel1)
Dejvice haly
Laborator 122
roomT2:G1-122b

14:30–16:00
(lecture parallel1)
Dejvice haly
Laborator 122
roomT2:G1-122b

16:15–17:45
(lecture parallel1)
Dejvice haly
Laborator 122
Fri
The course is a part of the following study plans:
Data valid to 2020-07-15
For updated information see http://bilakniha.cvut.cz/en/predmet5581406.html