Manufacturing of Electronic Equipment

The course is not on the list Without time-table
Code Completion Credits Range Language
AE1M13VEZ Z,ZK 5 2P+2L English
Department of Electrotechnology

Mechanical and electrical design. The electric contact. Joining of conductors. Cooling of components and equipment Printed circuit boards fabrication. Soldering in electronics. Electromagnetic compatibility of electronic equipment. Protection of components and equipment, sensitive on electrostatic field. Certification, accreditation, quality control and quality assurance.


A student has to obtain a credit before an examination.

Syllabus of lectures:

1.Mechanical and electrical design of electronics equipment

2.Electrical contacts. Basic feature. Application.

3.Mechanical, metallurgical and adhesive joints in electronics

4.Influence of environmentalism on construction and materials of joints.

5. PCBs of different types including flexible PCBs

6. Assembly in electronics - THT

7. Assembly in electronics - SMT

8.Production facility for assembly electronics

9. Temperature conditions of components and equipment. Crystal oven, cooling, heat pipe.

10.Manufacturing, operating and working environment.

11. Protection of components and equipment sensitive on electrostatic discharge

12. Electromagnetic compatibility. Shielding of workplaces and equipment

13.In-production control, control of electronic production

14.ISO 9000, ISO 14 000, control and assurance of quality

Syllabus of tutorials:

1.Safety of operation in laboratories. Instructions of tasks.

2.Joints, jointing in electronics.

3.Electromechanical contact systems.

4.Measurement of contact resistance of contacts.

5.Fabrication of solder and adhesive joints.

6. Measurement of parameters of soldering and adhesives joints.

7.Electrostatic discharge sensitive components (ESDS).

8.Measurement of ionic contamination of components and PCB.

9.Visit to factory: manufacturing of electronics equipment.

10. Video demonstration - product equipment .

11. Mounting and repair PCB - manufacturing samples - part 1.

12. Mounting and repair PCB - manufacturing samples - part 2.

13.Shielding technology - demonstration and measurement of samples.

14.Evaluation of reports from measurements. A credit.

Study Objective:

Survey of modern methods of production of electronic devices capable of competition.

Study materials:

1.Mach, P., Skočil, Vl., Urbánek J. Montáž v elektronice. Praha: ČVUT. 2001

2. Hwang, J. S. Modern Solder Technology for Competetive Electronics

Manufacturing. McGraw-Hill, New York 1996.

3. Szendiuch, I.: Základy technologie mikroelektronických obvodů a systémů, VUTIUM Brno, 2006. ISBN 80-214-3292-6

4. Pietriková, A.,Ďurišin, J., Mach, P.: Diagnostika a optimalizácia použitia ekologických materialov pre vodivé spájanie v elektronike. FEI TU v Košiciach. ISBN 978-80-553-0447-2

5.Puttlitz, K. J., Stalter, A.K.: Handbook of Lead-Free Solder Technology for Microelectronic Assemblies. Marcel Dekker, Inc. New York - Basel, 2004. ISBN 0-8247-4870-0

6. Li,Yi., Lu, Daniel., Wong, C.P.: Electrical Conductive Adhesives with Nanotechnologies. Springer New York, 2010. ISBN 978-0-387-88782-1

7. Sung Jim Kim, Sang Woo Lee. Air Cooling Technology for Electronic

Equipment. CRC Press, Inc. New York. 1996

Recommended resources on topics (Theman-Litm-kapx):


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Further information:
No time-table has been prepared for this course
The course is a part of the following study plans:
Data valid to 2021-01-27
For updated information see http://bilakniha.cvut.cz/en/predmet12799704.html