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ČESKÉ VYSOKÉ UČENÍ TECHNICKÉ V PRAZE
STUDIJNÍ PLÁNY
2020/2021

Manufacturing of Electronic Equipment

Předmět není vypsán Nerozvrhuje se
Kód Zakončení Kredity Rozsah Jazyk výuky
BE1M13VEZ Z,ZK 5 2P+2L anglicky
Přednášející:
Cvičící:
Předmět zajišťuje:
katedra elektrotechnologie
Anotace:

Mechanical and electrical design. The electric contact. Joining of conductors. Cooling of components and equipment. Printed circuit boards fabrication. Soldering in electronics. Electromagnetic compatibility of electronic equipment. Protection of components and equipment sensitive on electrostatic field. Certification, accreditation, quality control and quality assurance.

Požadavky:

A student has to obtain a credit before an examination.

Osnova přednášek:

1.Mechanical and electrical design of electronics equipment

2.Electrical contacts. Basic feature. Application.

3.Mechanical, metallurgical and adhesive joints in electronics

4.Influence of environmentalism on construction and materials of joints.

5. PCBs of different types including flexible PCBs

6. Assembly in electronics - THT

7. Assembly in electronics - SMT

8.Production facility for assembly electronics

9. Temperature conditions of components and equipment. Thermostats, cooling, heat pipe.

10.Manufacturing, operating and working environment.

11. Protection of components and equipment sensitive on electrostatic discharge

12. Electromagnetic compatibility. Shielding of workplaces and equipment

13.In-production control, control of electronic production

14.ISO 9000, ISO 14 000, control and assurance of quality

Osnova cvičení:

1.Safety of operation in laboratories. Instructions of tasks.

2.Joints, jointing in electronics.

3.Electromechanical contact systems.

4.Measurement of contact resistance of contacts.

5.Fabrication of solder and adhesive joints.

6. Measurement of parameters of soldering and adhesives joints.

7.Electrostatic discharge sensitive components (ESDS).

8.Measurement of temperature in electronic equipment

9.Visit to factory: manufacturing of electronics equipment.

10. Video demonstration - product equipment .

11. Mounting and repair PCB - manufacturing samples - part 1.

12. Mounting and repair PCB - manufacturing samples - part 2.

13.Shielding technology - demonstration and measurement of samples.

14.Evaluation of reports from measurements. A credit.

Cíle studia:

Survey of modern methods of production of electronic devices capable of competition.

Studijní materiály:

1 Hwang, J. S. Modern Solder Technology for Competetive Electronics

Manufacturing. McGraw-Hill, New York 1996.

2 Sung Jim Kim, Sang Woo Lee. Air Cooling Technology for Electronic

Equipment. CRC Press, Inc. New York. 1996

3 Lee, Ning-Cheng: Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies, Newnes, Butterworth-Heinemann, USA, 2002

Poznámka:

Rozsah výuky v kombinované formě studia: 14p+6l

Další informace:
https://moodle.fel.cvut.cz/courses/A1M13VEZ
Pro tento předmět se rozvrh nepřipravuje
Předmět je součástí následujících studijních plánů:
Platnost dat k 20. 9. 2020
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