Manufacturing of Electronic Equipment

The course is a substitute for:

Manufacturing of Electronics Equipment (13VEZ)

Lecturer:

Tutor:

Supervisor:

Department of Electrotechnology

Synopsis:

Mechanical and electrical design. The electric contact. Joining of conductors. Thermal regime of boards and equipment. Cooling of components and equipment. Computer aided design of printed circuit boards. Printed circuit boards fabrication. Soldering in electronics. Methods of board repairs. Electromagnetic compatibility of electronic equipment.Protection of components and equipment, sensitive on electrostatic field. Certification, accreditation, quality control and quality assurance.

Requirements:

A student has to obtain a credit before an examination

Syllabus of lectures:

1.Mechanical and electrical design of electronics equipment

2.Electrical contacts. Connectors

3.Mechanical and metallurgical joints in electronics

4.Soldering and gluing in electronics

5.Soft solders without Pb

6.PCBs of different types including flexible PCBs

7.Assembly in electronics - THT and SMT

8.Temperature conditions of components, PCBs and equipment

9.Working and fabrication environment

10.Electromagnetic compatibility

11.Shielding of workplaces and equipment

12.Protection of components and equipment sensitive on electrostatic field

13.In-production control, control of electronic production

14.ISO 9000, ISO 14 000, control and assurance of quality

Syllabus of tutorials:

1.Safety of operation in laboratories. Instructions of tasks

2.Joints, jointing in electronics

3.Electromechanical contact systems

4.Measurement of contact resistance of contacts and mechanical joints

5.Measurement of parameters of soldering and adhesives joints

6.Testing of solderability

7.Electrostatic discharge sensitive components (ESDS).

8.Measurement of ionic contamination of components and PCB

9.Visit to factory: manufacturing of electronics equipment

10.Mounting and repair PCB - manufacturing samples - part 1

11.Mounting and repair PCB - manufacturing samples - part 2

12.Video demonstration - product equipment

13.Shielding technology - demonstration and measurement of samples

14.Evaluation of reports from measurements. A credit.

Study Objective:

Survey of modern methods of production of electronic devices capable of competition.

Study materials:

[1] Hwang, J. S. Modern Solder Technology for Competetive Electronics

Manufacturing. McGraw-Hill, New York 1996.

[2] Sung Jim Kim, Sang Woo Lee. Air Cooling Technology for Electronic

Equipment. CRC Press, Inc. New York. 1996

Note:

Further information:

No time-table has been prepared for this course

The course is a part of the following study plans:

• Economics and Management in Electrical Engineering- structured studies (compulsory course)