Soldering, Brazing and Adhesive Bonding

Lecturer:

Ladislav Kolařík (gar.)

Tutor:

Ladislav Kolařík (gar.)

Supervisor:

Department of Manufacturing Technology

Synopsis:

Description and specifics of soldering and brazing processes. Explanation of terms: surface tension, capillary action, wettability. Principles, techniques, equipment, application and use of these joining processes. Consumables (solders, fluxes), their function. Advantages and disadvantages. Health and safety issues. Adhesive bonding and it´s use. Theory of bonding and types of adhesives.

Requirements:

Syllabus of lectures:

Syllabus of tutorials:

Study Objective:

Study materials:

Ruža, V.: Pájení, SNTL, Praha, 1988

Note:

Time-table for winter semester 2011/2012:

Time-table is not available yet

Time-table for summer semester 2011/2012:

Time-table is not available yet

The course is a part of the following study plans: