Manufacturing of Electronic Equipment

Přednášející:

Jan Urbánek (gar.), Petr Černek, Jiří Podzemský

Cvičící:

Jan Urbánek (gar.), Petr Černek, Jiří Podzemský

Předmět zajišťuje:

katedra elektrotechnologie

Anotace:

Mechanical and electrical design. The electric contact. Joining of conductors. Cooling of components and equipment Printed circuit boards fabrication. Soldering in electronics. Electromagnetic compatibility of electronic equipment. Protection of components and equipment, sensitive on electrostatic field. Certification, accreditation, quality control and quality assurance.

Požadavky:

A student has to obtain a credit before an examination.

Osnova přednášek:

1.Mechanical and electrical design of electronics equipment

2.Electrical contacts. Basic feature. Application.

3.Mechanical, metallurgical and adhesive joints in electronics

4.Influence of environmentalism on construction and materials of joints.

5. PCBs of different types including flexible PCBs

6. Assembly in electronics - THT

7. Assembly in electronics - SMT

8.Production facility for assembly electronics

9. Temperature conditions of components and equipment. Crystal oven, cooling, heat pipe.

10.Manufacturing, operating and working environment.

11. Protection of components and equipment sensitive on electrostatic discharge

12. Electromagnetic compatibility. Shielding of workplaces and equipment

13.In-production control, control of electronic production

14.ISO 9000, ISO 14 000, control and assurance of quality

Osnova cvičení:

1.Safety of operation in laboratories. Instructions of tasks.

2.Joints, jointing in electronics.

3.Electromechanical contact systems.

4.Measurement of contact resistance of contacts.

5.Fabrication of solder and adhesive joints.

6. Measurement of parameters of soldering and adhesives joints.

7.Electrostatic discharge sensitive components (ESDS).

8.Measurement of ionic contamination of components and PCB.

9.Visit to factory: manufacturing of electronics equipment.

10. Video demonstration - product equipment .

11. Mounting and repair PCB - manufacturing samples - part 1.

12. Mounting and repair PCB - manufacturing samples - part 2.

13.Shielding technology - demonstration and measurement of samples.

14.Evaluation of reports from measurements. A credit.

Cíle studia:

Přehled moderních způsobů výroby konkurence schopných elektronických zařízení.

Studijní materiály:

1 Hwang, J. S. Modern Solder Technology for Competetive Electronics

Manufacturing. McGraw-Hill, New York 1996.

2 Sung Jim Kim, Sang Woo Lee. Air Cooling Technology for Electronic

Equipment. CRC Press, Inc. New York. 1996

Poznámka:

Rozsah výuky v kombinované formě studia: 14p+6l

Rozvrh na zimní semestr 2011/2012:

Rozvrh není připraven

Rozvrh na letní semestr 2011/2012:

Rozvrh není připraven

Předmět je součástí následujících studijních plánů:

• Electrical Engineering, Power Engineering and Management - Economy and Management of Electrical Eng. (povinný předmět programu)